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Forecast | core hope · core future! We invite you to explore the future "core" trend of plate-level fan-out packaging.

Time: 2019-06-19 00:00:00

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Driven by Internet of things, 5G, millimeter wave, silicon photon and other technologies The semiconductor industry is embracing a new round of development opportunities Board - level fan - out packag

Driven by Internet of things, 5G, millimeter wave, silicon photon and other technologies

The semiconductor industry is embracing a new round of development opportunities

Board - level fan - out packaging is a key link in the semiconductor industry

In order to accelerate the development of plate - level fan-out packaging industry

Construction of large plate - level fan - out package demonstration line


2019 international board level fan-out package exchange conference

And the opening ceremony of guangdong semiconductor intelligent equipment and system integration innovation center

Will bring you the global board level fan-out packaging industry pattern,

Detailed and unique analysis of cutting-edge technologies and market trends

activity background

Chip semiconductor industry, is an important part of the made in China, under the background of steady growth in the global semiconductor industry, with artificial intelligence, big data, cloud computing, virtual reality, 5 g communication such as a large number of application background, national and local governments in the IC chip manufacturing, assembly, test and the equipment and materials more and invest a lot of money and guidance,board type fan out encapsulated as a key ring, the semiconductor industry needsAccelerate the development of the plate level fan-out packaging industryTo this end, guangdong fozhixin microelectronics technology research co., LTD., guangdong semiconductor intelligent equipment and system integration innovation center, CNC equipment collaborative innovation research institute of guangzhou institute of technology, and other companies will jointly host the 2019 international panel fan-out packaging exchange meeting

Organization

guiding unit:

Guangdong provincial department of industry and information technology

Foshan municipal bureau of industry and information technology

Foshan high-tech industry development zone management committee

Foshan nanhai economic promotion bureau  

Foshan nanhai district shishan town economic promotion bureau

co-organizer:

Foshan nanhai district CNC equipment collaborative innovation research institute

Guangdong university of technology provincial construction of precision electronic manufacturing technology and equipment state key laboratory

Guangdong semiconductor intelligent equipment and system integration innovation center

Guangdong fo zhi xin microelectronics technology research co., LTD

Guangdong xinhua microelectronics technology co. LTD

Huachin semiconductor packaging pioneer technology research and development center co. LTD

5G medium and high frequency device innovation center

activity theme

Core hope · core future

                 ime and place

Time: 8:30 a.m. to 16:30 p.m. June 28

Venue: 3rd floor, CNC equipment collaborative innovation research institute of guangdong university of technology, block A, fok high-tech think tank center, no. 81 taoyuan road, shishan town, nanhai district, foshan city, guangdong province


activity content


Activity contact information


       杜毅嵩:18520907339   yisongdu@fzxsmc.com
        段   鹏: 15218904979   Pduan@fzxsmc.com



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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd
TEL:0757-86687061
E-mail:jiawenzhong@fzxsmc.com
Add:2/F,Block A,Buddha High-tech Think Tank Center,Nanhai High-tech Zone,Foshan City,Guangdong Province

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