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The research institute of guangzhou university of technology held a special exchange meeting on large-board fan-out packaging equipment and materials

Time: 2019-06-12 00:00:00

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On February 22, by the broad technical university, located in nanhai district, foshan city, nc equipment collaborative innovation institute province department of guangdong university of technology an

On February 22, by the broad technical university, located in nanhai district, foshan city, nc equipment collaborative innovation institute province department of guangdong university of technology and precision electronics manufacturing technology and equipment into the state key laboratory of China semiconductor hosted by the collaborative innovation, win-win cooperation level big board type fan out packaging equipment and materials exchange was held in wide Harbin industrial university institute of semiconductor packaging industry at home and abroad are invited outstanding entrepreneur, around a big board level type fan out packaging need model line construction equipment and materials to carry out the project communicationThis is semiconductor intelligent equipment and systems integration innovation center of guangdong province (hereinafter referred to as the semiconductor center) in foshan south China sea, for the first time to carry out the project communication meeting FanLi ya, deputy director of the ministry of industry and information technology in guangdong province hall, foshan city bureau of industry and information technology qing-yun zhang, deputy director, foshan high-tech industry development zone management committee, deputy director of the Li Manguang wide technical university institute hai-dong Yang dean and related leadership guests attended the meetingSemiconductor center, foshan city, is the first provincial manufacturing innovation center, in 2018 12 menstrual approval to start the construction of industry and information technology in guangdong province hall, and introduced the national talent full-time Lin Ting yu, Ph.D., long flexible introduced liu cinema Cui Chengqiang li-qiang cao and so on a number of top talent to join the center construction, become the center of the semiconductor's top think-tank, the construction of key construction target is the big board level type fan out to encapsulate model line, mainly around the semiconductor packaging equipment semiconductor testing equipmentBig BanShan encapsulation equipment and so on key generic technology, joint research, speed up the semiconductor packaging equipment and materials technology breakthrough, promote the development of semiconductor industry leapfrog big board level type fan out to encapsulate model line is expected to completed by the end of this year, after the completion will be the first big domestic plate type fan out to encapsulate demonstration line, is expected to invest more than $6, deputy director of the ministry of industry and information technology in guangdong province hall FanLi ya, points out that, the hall will vigorously support the development of the innovation center, promote the innovation in the semiconductor industry chain chain interaction developmentFoshan city of industry and information technology bureau deputy director qing-yun zhang thinks, foshan, most of the equipment manufacturing enterprises are relying on the advantage of existing traditional industries, between upstream and downstream enterprises closely with formed the benign interaction pattern, hope to accelerate the semiconductor institute resources agglomeration, promote the development of innovation center in foshan high-tech industrial development zone management committee, deputy director of Li Manguang said, facing the new era, foshan high-tech semiconductor equipment technology will be the important new gripper, efforts to promote the transformation from the projectGuangdong Buddha wisdom core microelectronics technology research co., LTD., as the center of the semiconductor carrying unit, will gather inside and outside the semiconductor equipment leading enterprise scientific research institutes of guangdong province local enterprise applications business, boost innovation center through the industrial chain upstream and downstream, the construction of big board level with domestic equipment materials for the core type fan out to encapsulate demonstration line at present, to participate in the exchange of 23 companies has six companies and semiconductor intelligent equipment and systems integration innovation center of guangdong province reached cooperation intention large BanShan out chips encapsulation is the low cost is the best way to encapsulateTechnology exchange meeting, international big BanShan guangdong Buddha wisdom, head of the international joint research sponsors and core microelectronics technology research co., LTD., vice general manager of Dr Lin Ting yu level to those entrepreneurs to introduce large plate type fan out packaging technology Lin Ting yu is introduced, the advantages of big board type fan out packaging technology to realize from a 12-inch wafer semiconductor packaging size to 600 600 mm across large board size, the cost is greatly reduced, and the process directly after the PCB substrate, reduce repetitive error, yield is greatly increasedFoshan has been tries to build up a national science and technology industry innovation center, large board type fan out to encapsulate demonstration line is completed, can carry out process and reliability verification, rapidly increasing domestic equipment craft materials, can provide chip support equipment support for the industry of foshan, for high-end semiconductor packaging equipment manufacturers to participate in this foundation board foshan opportunity wide technical university dean hai-dong Yang said that guangdong semiconductor, intelligent equipment and systems integration innovation center will be a lot of equipment and materials at home and abroad supplier in guangdong to promote semiconductor packaging services and industry technology upgrades provide appropriate platformDuring the meeting, vice President of the north China Wang Hougong foshan temple at science and technology co., LTD., general manager of shining suzhou delong laser co., LTD. Director: laser technology co., LTD Cai Changwei manager Yang deep Ming Japan ULVAC manager left super universe circuit board equipment co., LTD., vice general manager of dongguan giant lei tung and semiconductor equipment (Shanghai) co., LTD., vice general manager of Chen Sheng open respectively by physical vapor deposition equipment in the application of large BanShan out online testing equipment in the application of large BanShan out laser bonding equipment in the application of large BanShan out introduction to laser applications in the semiconductor industryPVD and descum development ULVAC in wet process equipment in the application of large BanShan out encapsulation equipment in large BanShan out during the project to share are made to the application for the theme, the participants also entered the research achievements exhibition hall and exhibition hall, semiconductor through a real case, more intuitive to present research in the field of semiconductor technology services and scientific research achievements, let visitors fully understand from manufacturing to the development of smart way and broad prospects

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