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The chief scientist team has signed on to lead foshan's first provincial manufacturing innovation center to tackle chip packaging

Time: 2019-06-12 00:00:00

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Established in 2017, in foshan national strategic deployment of manufacturing innovation center, institute with convergence in the field of semiconductor packaging equipment resources and technologica

Established in 2017, in foshan national strategic deployment of manufacturing innovation center, institute with convergence in the field of semiconductor packaging equipment resources and technological advantages, the joint cas electronic huazhong university wide technical university and other research institutes, and semiconductor intelligent equipment and systems integration innovation center, and to get the approval of ministry of guangdong province hall on January 17, extensive technical university institute held a provincial semiconductor intelligent equipment and systems integration innovation center chief scientist at the signing ceremony, then foshan high-tech zone management committee directorDistrict party committee, deputy secretary of the south China sea Liu Taogen, foshan science and technology bureau deputy director liang damien nanhai district economy, science and technology bureau deputy director Shen Hai Yang, foshan high-tech zone management committee, director of the office of outreach and manpower mei-jung Chen, foshan economic and information bureau technology progress coco long wan fang, southern medical university, Mr. Director of urology and other leaders, as well as representatives of friendly partner institute in incubated enterprises on behalf of the institute staff nearly 400 people attended the ceremony, such as economic and information bureau chief, foshan city wan "read at the meetingOf industry and information technology in guangdong province hall about agreed to form a semiconductor intelligent equipment and systems integration innovation center, guangdong province, foshan city, the approval documents of the semiconductor center is the first provincial manufacturing innovation center, in 2018 12 menstrual approval to start the construction of industry and information technology in guangdong province hall, and introduced the national talent full-time Lin Ting yu, Ph.D., long flexible introduced liu cinema Cui Chengqiang li-qiang cao and so on a number of top talent to join the center construction, become the center of the semiconductor's top think-tank, the construction of key construction target is the big board level type fan out to encapsulate model line, mainly around the semiconductor packaging equipment semiconductor testing equipmentBig BanShan encapsulation equipment and so on key generic technology, joint research, speed up the semiconductor packaging equipment and materials technology breakthrough, promote the development of semiconductor industry leapfrog big board level type fan out to encapsulate model line is expected to completed by the end of this year, after the completion will be the first big domestic plate type fan out to encapsulate demonstration line, is expected to invest more than $6 in the Liu Taogen beam damien Shen Hai Yang wan fang mei-jung Chen leadership under the witness of, assembly and the semiconductor intelligent equipment and systems integration innovation center, guangdong province, chief scientist at the signing ceremony on semiconductor intelligent equipment and systems integration innovation center in guangdong province, in 2018, Harbin industrial university institute of full-time state-level experts introduced Lin Ting yu, Ph.D., long flexible introduced liu cinema Cui Chengqiang li-qiang cao and so on a number of top talent to join the institute, to become the center of the semiconductor's top think-tank Lin Ting yu said that the future will go all out to semiconductor center construction, make its own technology to better link industry Lin Ting Dr Yu is board-level integration type fan out to encapsulate the core technology research and development project chief scientist at the international big BanShan technology international joint research sponsors and headLong engaged in microelectronics packaging and reliability research, 44 application for invention patents, accumulative total 34 authorized patents, published 150 papers, 2017 the 12th China's semiconductor and innovative products and technology awards (large plate integrated fan out advanced packaging technology), 2015 the tenth China's semiconductor and innovative products and technology awards (2.5 D TSV silicon adapter plate manufacturing and system integration technology) in the world 500 strong enterprises to work more than 20 years, is rich in semiconductor packaging communication and consumer electronics industry research and development experience in design and mass productionLin Ting yu said that the future will go all out on your good semiconductor center construction, make its own technology to better link industry so far, semiconductor center has attracted 20 industry experts, hatching the acaroid seven semiconductor fields such as science and technology, intelligent enterprise, research and development of new products more than 10, 20 patents results, has brought together a number of both semiconductor equipment leading enterprise application, local enterprises in scientific research institutes, through upstream and downstream industry chain

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TEL:0757-86687061
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Add:2/F,Block A,Buddha High-tech Think Tank Center,Nanhai High-tech Zone,Foshan City,Guangdong Province

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