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A meeting of fan-out packaging technology exchange was held in guangzhou institute of technology

Time: 2019-06-12 00:00:00

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On March 11, by the broad technical university, located in nanhai district, foshan city, nc equipment collaborative innovation research institute, the moonlight group type Fan out Packaging Technology

On March 11, by the broad technical university, located in nanhai district, foshan city, nc equipment collaborative innovation research institute, the moonlight group type Fan out Packaging Technology exchange meeting hosted by the wide in Harbin industrial university institute, professor, deputy general manager of the meeting invited, moonlight evan guo made a Fan - out to share the theme of the Packaging Technology, guangdong university of Technology to build, deputy director of state key laboratory of the guangdong province department Buddha wisdom core microelectronics Technology research co., LTD., general manager of professor Cui Chengjiang international big BanShan Technology international joint research sponsors and headGuangdong Buddha wisdom core microelectronics technology research co., LTD., vice general manager of Dr Lin Ting yu guang Xiong Wei, vice President of the institute of Harbin industrial university and other relevant leaders and relevant person in charge of semiconductor center attended the meeting evan guo professor introduction: since the last century 60 s, the development of semiconductor technology has been following the Moore's law as the characteristics of the integrated circuit size dropped to under 14 nm, the semiconductor technology is gradually approaching the limit of the silicon technology research and development of the resulting costs and to upgrade the wafer manufacturing devices and equipment costs, make provide in semiconductor device manufacturing cost is very expensiveFuture product development direction is high density integration and miniaturization volume, in the era of Moore to implement performance improvement depends on the advanced packaging technology breakthrough at the same time, with the high-speed development of the global market, the user demand for multi-functional high-performance high integration electronic product more and more big, from consumer products such as smartphone tablet expanded to 5 g communication microwave radar large data centers and other high-end products, appear more and more high integration complexity is lower and lower power consumption and cost high density integration corresponding to the trend of advanced packaging technology put forward higher request type fan out wafer level packaging technology arises at the historic momentThe technology can be on the wafer by RDL (layout) again will a single chip I/O to fan out, increasing individual packaging area, thereby improving the overall I/O number compared with the traditional single IC chip encapsulation way, fan out type wafer level packaging technology can get smaller packaging size better electrical performance and higher thermal Lin Ting packing density of yu, "said Dr Type fanout wafer level packaging equipment in such aspects as wafer alignment technology take the product need special transformation in addition, due to the limited utilization wafer, high cost is still the main obstacle is difficult to be adopted in the mass productionEspecially in the low and medium end fields such as rf chip power management chip with fewer I/O ports, the advantages of large-board fan-out packaging are very obvious

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